| Our Capabilities
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| Front-End Wafer Equipment |
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Wafer handler |
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Wafer Inspection Equipment |
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| Semiconductor Back-End
Equipment |
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Wire Bonder |
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Die attach |
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Encapsulation equipment |
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Test equipment |
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| SMT Process Equipment |
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Solder paste printing machine |
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X-ray equipment |
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Test processing equipment |
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Reflow oven |
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| Disc Drive Processing and
Test Equipment |
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| Our Services: |
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| Leveraging on our proven vertically integrated set up and our inherent
manufacturing flexibility, we offer one-stop equipment manufacturing services,
which includes: |
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Bill of material (BOM ownership and management) |
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Project management of equipment build technical transfer |
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Extensive supply chain management |
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Components localization program |
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Equipment assembly procedures/activities improvement |
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Equipment pre-shipment buy-off |
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Materials handled - aluminium, copper, mild steel, stainless steel
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Next generation equipment design collaboration |
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Product Industrialization |
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